1. product pro?le 1.1 general description ultrafast, epitaxial recti?er diode in a sot428 (dpak) surface-mountable plastic package. 1.2 features 1.3 applications 1.4 quick reference data 2. pinning information [1] it is not possible to connect to pin 2 of the sot428 package. BYV25D-600 recti?er diode, ultrafast rev. 01 29 july 2008 product data sheet n fast switching n low thermal resistance n soft recovery characteristic n high thermal cycling performance n low forward voltage drop n high frequency switched-mode power supplies n discontinuous current mode (dcm) power factor correction (pfc) n v rrm 600 v n i f(av) 5a n v f 1.11 v n t rr 60 ns table 1. pinning pin description simpli?ed outline graphic symbol 1 no connection sot428 (dpak) 2 cathode (k) [1] 3 anode (a) mb mounting base; cathode (k) 3 2 mb 1 a 001aaa020 k
BYV25D-600_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 29 july 2008 2 of 9 nxp semiconductors BYV25D-600 recti?er diode, ultrafast 3. ordering information 4. limiting values table 2. ordering information type number package name description version BYV25D-600 dpak plastic single-ended surface-mounted package (dpak); 3-leads (one lead cropped) sot428 table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v rrm repetitive peak reverse voltage - 600 v v rwm crest working reverse voltage - 600 v v r reverse voltage square waveform; d = 1.0; t mb 100 c - 600 v i f(av) average forward current square waveform; d = 0.5; t mb 131 c-5a i frm repetitive peak forward current square waveform; d = 0.5; t mb 131 c - 10 a i fsm non-repetitive peak forward current t = 10 ms; sinusoidal waveform - 60 a t = 8.3 ms; sinusoidal waveform - 66 a t stg storage temperature - 40 +150 c t j junction temperature - 150 c
BYV25D-600_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 29 july 2008 3 of 9 nxp semiconductors BYV25D-600 recti?er diode, ultrafast 5. thermal characteristics [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. table 4. thermal characteristics symbol parameter conditions min typ max unit r th(j-mb) thermal resistance from junction to mounting base with heatsink compound; see figure 1 - - 3.0 k/w r th(j-a) thermal resistance from junction to ambient in free air [1] - 50 - k/w fig 1. transient thermal impedance from junction to mounting base as a function of pulse width 003aac235 1 10 - 1 10 z th(j-mb) (k/w) 10 - 3 10 - 2 t p (s) 10 - 6 10 1 10 - 1 10 - 5 10 - 3 10 - 2 10 - 4 t p t p t p t t d =
BYV25D-600_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 29 july 2008 4 of 9 nxp semiconductors BYV25D-600 recti?er diode, ultrafast 6. characteristics table 5. characteristics t j = 25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit static characteristics v f forward voltage i f = 5 a; t j = 150 c; see figure 2 - 0.97 1.11 v i f = 5 a - 1.12 1.30 v i r reverse current v r = 600 v - 2 50 m a v r = 600 v; t j = 100 c - 0.1 0.35 ma dynamic characteristics q r recovered charge i f =2atov r 3 30 v; di f /dt=20a/ m s; see figure 3 - 4070nc t rr reverse recovery time i f = 1 a to v r 3 30 v; di f /dt = 100 a/ m s; see figure 3 - 5060ns i rm peak reverse recovery current i f = 10 a to v r 3 30 v; di f /dt=50a/ m s; t j = 100 c; see figure 3 - 3 5.5 a v fr forward recovery voltage i f = 10 a; di f /dt=10a/ m s; see figure 4 - 3.2 - v (1) t j = 150 c; typical values (2) t j = 150 c; maximum values (3) t j =25 c; maximum values fig 2. forward current as a function of forward voltage 003aac232 0 5 10 15 0 0.4 0.8 1.2 1.6 v f (v) i f (a) (1) (2) (3)
BYV25D-600_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 29 july 2008 5 of 9 nxp semiconductors BYV25D-600 recti?er diode, ultrafast fig 3. reverse recovery de?nitions fig 4. forward recovery de?nitions 001aab911 t rr time 100 % 10 % i f dl f dt i r i rm q r 001aab912 time time v fr v f i f v f i f(av) =i f(rms) ?d a = form factor = i f(rms) /i f(av) fig 5. forward power dissipation as a function of average forward current; square waveform; maximum values fig 6. forward power dissipation as a function of average forward current; sinusoidal waveform; maximum values 003aac233 0 2 4 6 8 10 02468 i f(av) (a) p tot (w) 0.5 0.2 0.1 d = 1 003aac234 0 2 4 6 8 0246 i f(av) (a) p tot (w) a = 1.57 1.9 2.2 2.8 4.0
BYV25D-600_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 29 july 2008 6 of 9 nxp semiconductors BYV25D-600 recti?er diode, ultrafast 7. package outline fig 7. package outline sot428 (to-252) references outline version european projection issue date iec jedec jeita sot428 sc-63 to-252 sot428 06-02-14 06-03-16 dimensions (mm are the original dimensions) plastic single-ended surface-mounted package (dpak); 3 leads (one lead cropped) a 2 13 e 1 d 2 d 1 h d l l 1 l 2 e 1 e mounting base wa m b e b 2 b 1 c a 1 y 0 5 10 mm scale unit mm 0.93 0.46 5.46 5.00 0.56 0.20 6.22 5.98 6.73 6.47 10.4 9.6 2.95 2.55 a 1 2.38 2.22 ab 2 1.1 0.9 b 1 e 1 0.89 0.71 bcd 1 0.9 0.5 l 2 ee 2.285 4.57 4.0 d 2 min 4.45 e 1 min 0.5 l 1 min h d lw 0.2 y max 0.2 a
BYV25D-600_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 29 july 2008 7 of 9 nxp semiconductors BYV25D-600 recti?er diode, ultrafast 8. revision history table 6. revision history document id release date data sheet status change notice supersedes BYV25D-600_1 20080729 product data sheet - -
BYV25D-600_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 29 july 2008 8 of 9 nxp semiconductors BYV25D-600 recti?er diode, ultrafast 9. legal information 9.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 9.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 9.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. quick reference data the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 9.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 10. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors BYV25D-600 recti?er diode, ultrafast ? nxp b.v. 2008. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 29 july 2008 document identifier: BYV25D-600_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 11. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 thermal characteristics. . . . . . . . . . . . . . . . . . . 3 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 legal information. . . . . . . . . . . . . . . . . . . . . . . . 8 9.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 9.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 9.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 9.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 contact information. . . . . . . . . . . . . . . . . . . . . . 8 11 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
|
